3 articles
Nvidia's pushing for 16-layer High Bandwidth Memory by late 2025, sparking an intense tech race between Samsung, SK Hynix, and Micron to crack the manufacturing challenges first.
SK Hynix delays large-scale HBM4 production from Q2 to Q3 2025, adjusting to shifting AI chip timelines while maintaining strong HBM3E output to meet current demand.
SK Hynix will spend 600 trillion KRW, about $400 billion, to expand the Yongin Semiconductor Cluster until 2050. The bill rises because the cleanrooms must grow larger and the machines cost more.
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