5 articles
OpenAI's pre-IPO filing flags $13B Microsoft dependency and TSMC supply chain risks as key threats to its AI infrastructure.
UBS projects TSMC could earn up to $34.4 billion from AI server deployments linked to OpenAI and major cloud partners, with each 1GW project bringing in $1–2 billion in foundry revenue.
TSMC is fast-tracking its Chip-on-Panel-on-Substrate technology, shifting from traditional wafers to 310mm × 310mm panels with pilot production starting in 2026 and full-scale manufacturing by 2028-2029 to meet exploding AI chip demand.
Nvidia ($NVDA) has reportedly asked TSMC to ramp up 3nm wafer production for Blackwell chips by as much as 50%—from around 100k–110k wafers per month to roughly 160k. The company says demand is growing "month by month," and all three HBM suppliers are ready to support the push.
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Saad Ullah
Peter Smith
Eseandre Mordi
